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The latest changes across PCI SSC resources and EMVCo specifications.

💳 EMVCo Type Approval Bulletins

3DSA Bulletin nº 30: 3DS SDK 2.3 Testing Optimization

As part of ongoing efforts to further improve 3DS SDK testing process, EMVCo is introducing a reduced SDK UI testing approach that will complement the regression testing approach introduced in the 3DS Approval Bulletin No.29. This new process applies to all …
💳 EMVCo Type Approval Bulletins

FSA Bulletin nº 01: Fingerprint Sensor Assessment Fees

The EMV Fingerprint Sensor Assessment fee structure outlined below will be applicable for all Requests for TAS for Fingerprint Sensor products submitted to EMVCo from December 1, 2025, onwards. Fee Product Provider fees Fingerprint Sensor Request for TAS …