EMV® Card Level 1 Type Approval – PICC Analogue Test Bench and Test Case Requirements

EMV® Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements Version 3.2b.r September 2025

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Legal Notice

This document summarizes EMVCo’s present plans for evaluation services and related policies and is subject to change by EMVCo at any time. This document does not create any binding obligations upon EMVCo or any third party regarding the subject matter of this document, which obligations will exist, if at all, only to the extent set forth in separate written agreements executed by EMVCo or such third parties. In the absence of such a written agreement, no product provider, test laboratory or any other third party should rely on this document, and EMVCo shall not be liable for any such reliance. No product provider, test laboratory or other third party may refer to a product, service or facility as EMVCo approved, in form or in substance, nor otherwise state or imply that EMVCo (or any agent of EMVCo) has in whole or part approved a product provider, test laboratory or other third party or its products, services, or facilities, except to the extent and subject to the terms, conditions and restrictions expressly set forth in a written agreement with EMVCo, or in an approval letter, compliance certificate or similar document issued by EMVCo. All other references to EMVCo approval are strictly prohibited by EMVCo. Under no circumstances should EMVCo approvals, when granted, be construed to imply any endorsement or warranty regarding the security, functionality, quality, or performance of any particular product or service, and no party shall state or imply anything to the contrary. EMVCo specifically disclaims any and all representations and warranties with respect to products that have received evaluations or approvals, and to the evaluation process generally, including, without limitation, any implied warranties of merchantability, fitness for purpose or noninfringement. All warranties, rights and remedies relating to products and services that have undergone evaluation by EMVCo are provided solely by the parties selling or otherwise providing such products or services, and not by EMVCo, and EMVCo will have no liability whatsoever in connection with such products and services. This document is provided "AS IS" without warranties of any kind, and EMVCo neither assumes nor accepts any liability for any errors or omissions contained in this document. EMVCO DISCLAIMS ALL REPRESENTATIONS AND WARRANTIES, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE AND NONINFRINGEMENT, AS TO THIS DOCUMENT. EMVCo makes no representations or warranties with respect to intellectual property rights of any third parties in or in relation to this document. EMVCo undertakes no responsibility to determine whether any implementation of this document may violate, infringe, or otherwise exercise the patent, copyright, trademark, trade secret, know-how, or other intellectual property rights of third parties, and thus any person who implements any part of this document should consult an intellectual property attorney before any such implementation. Without limiting the foregoing, this document may provide for the use of public key encryption and other technology, which may be the subject matter of patents in several countries. Any party seeking to implement this document is solely responsible for determining whether its activities require a license to any such technology, including for patents on public key encryption technology. EMVCo shall not be liable under any theory for any party's infringement of any intellectual property rights in connection with this document.

Revision Log – 3.2b.r The following changes have been made to the document since the publication of Version 3.2b. Some of the numbering and cross references in this version have been updated to reflect changes introduced by the published bulletins. The numbering of existing requirements did not change, unless explicitly stated otherwise. Incorporated changes: None Other editorial changes: Editorial updates

1. 1. 1. 1.3.1 1.3. 1. 1. 1.5. 1. 1. 2. 2. 2.2.1 2.2.2 2.2.3 2.2.4 2.2.5 2.2. 2. 2.3.1 2.3.2 2.3. 3. 3. 3.2.1 3.2.2 3.2.3 3.2. Positioning Characteristics for the PICC Under Test. Relative Positioning of the PICC Under Test and EMV – TEST PCD... 14 3. 3. 3.4.1 3.4. 3. 4. 4.1.1 4.1.2 4.1.3 4.1. 4. 4.2.

4.2.2 4.2.3 4.2.4 4.3 4.3.1 4.3.2 4.3.3 4.3. 5. 5.1.1 5.1. 5. 5.2.1 5.2.2 5.2.3 5.2.4 5.2. 5. 5.3.1 5.3. 5. 5.4.1 5.4. 6. 6. 6. 6. 6. 6. 6.6.1 6.6.2 6.6.3 6.6.4 6.6. 7. 7. 7.2. 7. 7.3. 7. 7.4.1 7.4. 7.

Page v 7.5.1 Cross-Verifying the EMV – TEST PCD and the EMV – TEST PICCs... 8. 8. 8.2.1 8.2. 8. 8.3. 8.3. 8.3. 8.3. 8. 8.4.1 8.4.2 8.4.3 8.4. 8. 8. 8. 8.7.1 8.7. 8. 8.8.1 8.8.2 8.8.3 8.8.4 8.8.5 8.8.6 8.8.7 8.8.8 8.8. A. A.1. B. B.1. C. C.1. C.2. C.3. C.4. C.5. C.6. C.7. D.

D.1. D.1.1. D.1.2. E. F.

Figure 4-1—EMV – TEST PICC 1, Version 3. Figure 4-2—EMV – TEST PICC 1, Version 3. Figure 4-3—EMV – TEST PCD, Version 3.0 Figure 4-4—EMV – TEST CMR Circuit Board, Version 2.1 Figure 8. Figure 8. Figure 8. Figure 8.

Figure 8-18—Typical Lower and Upper Subcarrier Peaks of Load Modulation (Type A)... Figure 8-23—Typical Lower and Upper Subcarrier Peaks of Load Modulation (Type B)...

Table 8-12—z values to be tested for CAB111. Table 8-13—Test Positions of Test CA121. Table 8-15—Test Positions of Test CA122. Table 8-17—Test Positions of Test CA123.

Table 8-21—Test Positions of Test CA126. Table 8-23—Test Positions of Test CA127. Table 8-25—Test positions of test CA131. Table 8-32—Test Positions of Test CA134. Table 8-36—Test Positions of Test CB121. Table 8-38—Test Positions of Test CB122. Table 8-41—Test Positions of Test CB123. Table 8-45—Test Positions of Test CB126. Table 8-49—Test Positions for Test CB127. Table 8-53—Test Positions for Test CB128. Table 8-56—Test positions of test CB131. Table 8-63—Test Positions of Test CB134. Table 8-69—Test Positions of Test CA151. Table 8-71—Test Positions of Test CB151.

of 209 1 Using this Manual 1.1

Purpose

The EMV Contactless Card Level 1 Type Approval: PICC Analogue Test Bench and Test Case Requirements manual provides the requirements for procedures and test equipment used for testing the analogue interface PICCs. These requirements are in accordance with the EMV Level 1 Specifications for Payment Systems ― EMV Contactless Interface Specification 3.2, July 2022.

1.2 Audience This manual is provided to:

• Testing Laboratories that perform PICC testing activities on behalf of EMVCo.
• Test Tool Providers
• Product Providers 1.3 Reference Documents 1.3.1 Standards Documents Reference ISO 639: 1988 ISO/IEC 7810 ISO/IEC 14443-1 ISO/IEC 14443-2 ISO/IEC 14443-3 ISO/IEC 14443-4

Description

Codes for the representation of names and languages Identification cards – Physical characteristics Identification cards

• Contactless integrated circuit(s) cards
• Proximity cards
• Part 1: Physical characteristics Identification cards
• Contactless integrated circuit(s) cards
• Proximity cards
• Part 2: Radio frequency power and signal interface Identification cards
• Contactless integrated circuit(s) cards
• Proximity cards
• Part 3: Initialization and anti-collision Identification cards
• Contactless integrated circuit(s) cards
• Proximity cards
• Part 4: Transmission protocol of 209 Reference ISO/IEC 13239 ISO / IEC 10373- 6 ISO / IEC 17025:2017 ISO/IEC Guide 98-3:2008 ISO 5725:1994 (6 parts) Description Information technology – Telecommunications and information exchange between systems – High-level data link control (HDLC) procedures Identification cards
• Test Methods
• Part 6: Proximity Cards General Requirements for the Competence of Calibration and Testing Laboratories Uncertainty of measurement ― Part 3: Guide to the expression of uncertainty in measurement (GUM:1995) Accuracy (trueness and precision) of measurement methods and results 1.3.2 Specification Documents Document EMV Level 1 Specifications for Payment Systems ― EMV Contactless Interface Specification EMV Specification Bulletin No 282: PPS0 and PPS1 RFU Value Handling EMV Specification Bulletin No 283: PCD Carrier Phase Drift EMV Specification Bulletin No. 300 – PICC Presence Check Procedure EMV Specification Bulletin No. 303 Adding an Optional Suspend and a Mandatory Suspend in the Polling Loop EMV Level 1 Specifications for Payment Systems – Contactless Test Equipment Specifications – PICC Manual EMV Level 1 Specifications for Payment Systems – Contactless Test Equipment Specifications – PCD Manual EMV Contactless Specifications for Payment Systems – Level 1 – Test Equipment Specifications – CMR Manual Version Issue Date Version 3.2, July 2022 First Edition, March 2023 First Edition, March 2023 First Edition, June 2024 Second Edition, May 2024 Version 3.0.2, February 2022 Version 3.0.1, February 2022 Version 2.1, February 2012 1.4

Definitions

Term Analogue Test Definition Set of tests that check the Radio Frequency characteristics of the hardware and software/firmware of the PCD against the EMV Specifications.

of 209 Term EMV – TEST CMR EMV – TEST PCD EMV – TEST PICC [ISO/IEC 10373-6] Calibration Coil 1 Envelope Landing Plane Loopback mode Modulation Index Operating Volume Polling Presentation Plane Proximity Coupling Device (PCD) Proximity Integrated Circuit Card (PICC) Sample Set-up Terminal Test Bench Definition A hardware device qualified as reference equipment which is used with other EMV – TEST Equipment. Its purpose is to condition and switch signals between its inputs and outputs. A hardware device qualified as reference equipment which is used with other EMV Test Equipment. Its purpose is to simulate a PCD. A PICC simulator used for EMV testing Hardware device used to measure Reset and Power Off functions. Waveform connecting positive or negative peaks of oscillating signal. The designated surface area of a PCD where a user should place a PICC to obtain a successful transaction. Loopback involves cycling back information in a channel. Any data transmitted through such a channel is immediately received by the same channel. A device is in loopback mode after such a mode has been activated. The modulation index of an amplitude modulated signal is defined as mi = ([A(t)]MAX - [A(t)]MIN)/([A(t)]MAX + [A(t)]MIN)) where A(t) is the envelope of the modulated carrier. The 3-dimensional space in which the EMV – TEST PCD shall reliably communicate with a PICC by means of a magnetic field. Sequence during which the PCD sends alternatively WUPA and WUPB commands until a response is received. The plane of a PICC that faces the EMV – TEST PCD Landing Plane during testing. A hardware device that uses inductive coupling to provide power to the PICC and exchange data with the PICC. A hardware device containing an integrated circuit and capable of inductive coupling in the proximity of a coupling device. A physical implementation of a PICC or a PCD delivered to the Testing Laboratory for testing. Procedure to follow to prepare EMV Test Equipment before starting a test. Any device used to interact with a PICC and which operates to the requirements of the EMV Level 1 Specifications for Payment Systems ― EMV Contactless Interface Specification. This includes the PCD and may also include other components and interfaces. A specific test bench as described in the EMVCo Contactless Type Approval: PICC Analogue Test Bench and Test Case Requirements manual.

of 209 Term Test Case Test Code Testing Laboratory Transaction Definition Test to verify a requirement at a specific position in the Operating Volume. Code to identify a Test Case. A facility recognised by EMVCo for performing EMV Contactless testing of the analogue interface for PICCs and PCDs. A sequence of logic interactions that the PICC and the Terminal shall execute as foreseen by the EMV Contactless application. The transaction starts with the first logic message from the PCD to the PICC.

1.5 Notational Conventions The following notational conventions apply: Notation z, r, φ, θ Description These four coordinates define the position of the PICC in the Operating Volume. The coordinates z, r, and φ are the coordinates of the centre of the Presentation Plane. The coordinate θ is the angle between the φ=0 axis of the PCD, and the φc=0 axis of the PICC. (zrf) Position label indicating the values for coordinates z, r, φ. xx Value.

1.5.1 Acronyms and Abbreviations A/D AC CLn APDU ASK ATQA ATQB ATTRIB BPSK CH0 CH1 Abbreviation Description Analogue to Digital Anti-collision Cascade Level n, Type A Application Protocol Data Unit Amplitude Shift Keying

Answer

To reQuest, Type A Answer To reQuest, Type B PICC Selection Command, Type B Binary Phase Shift Keying Channel 0 Channel 1

of 209 CLK CMR CTA CUT DIV DSO EMC EMI EoF EoS etu fC fS HLTA HLTB I2C IC ICS ID-1 IEC MSa/s PAN PCD PICC RATS RF RH SELECT CLn SMA SoF SoS Trg TTL UID Abbreviation Clock Description Common Mode Rejection Card Type Approval Card Under Test Division Digital Sampling Oscilloscope ElectroMagnetic Compatibility ElectroMagnetic Interference End of Frame End of Sequence Elementary time unit Carrier Frequency Subcarrier Frequency Halt Command, Type A Halt Command, Type B Inter Integrated Circuit Integrated Circuit Implementation Conformance Statement Identification Card Format International Electro-technical Commission Mega Samples / Second Primary Account Number Proximity Coupling Device Proximity IC Card Request for Answer to Select, Type A Radio Frequency Relative Humidity Select Cascade Level n, Type A Sub-miniature version A Start of Frame Start of Sequence Trigger Transistor-Transistor Logic Unique Identifier, Type A

of 209 VPP VSWR WTX WTXM WUPA WUPB Abbreviation Description Peak to Peak Amplitude Voltage Voltage Standing Wave Ratio Waiting Time eXtension Waiting Time eXtension Multiplier Wake UP command, Type A Wake UP command, Type B 1.6 Terminology and Conventions The following words are used often in this specification and have a specific meaning: Shall Defines a product or system capability which is mandatory. May Defines a product or system capability which is optional or a statement which is informative only and is out of scope for this specification. Should Defines a product or system capability which is recommended.

1.7 Support For support regarding EMV Contactless analogue testing, refer to www.emvco.com.

2 Requirements for Testing Laboratories

of 209 2.1 Overview and Requirements The EMVCo Contactless Card Type Approval: PICC Analogue Test Bench and Test Case Requirements manual provides the Test Cases for testing the analogue interface of contactless cards. Analogue Interface Testing is one of the phases related to EMVCo Card Type Approval (CTA).

2.2 Recognition Requirements This section describes the requirements for passing full recognition. Replacing the test equipment by any other devices voids recognition for testing of the Analogue interface for EMV Contactless products.

2.2.1 Use of EMV – TEST Equipment The EMV Test Equipment includes the following:

2.2.1.1 EMV – TEST Proximity Integrated Circuit Card The EMV – TEST Proximity Integrated Circuit Card (PICC) emulates the radio frequency (RF) interface of EMV Contactless PICCs with different form factors and resonance frequencies.

2.2.1.2 EMV – TEST Proximity Coupling Device The EMV – TEST Proximity Coupling Device (PCD) emulates the RF interface of an EMV Contactless terminal.

2.2.1.3 EMV – TEST Common Mode Rejection Circuit Board The EMV – TEST Common Mode Rejection (CMR) circuit board aims at conditioning signals and switching them between its inputs and outputs for Test Bench set-ups.

2.2.2 Creation of the Test Bench The Testing Laboratory shall use an EMVCo qualified Test Tool for its test bench creation. The Test Tool shall include:

• The EMV – TEST PICC 1
• The EMV – TEST PICC 2
• The EMV – TEST PCD v3.0
• The EMV – TEST CMR
• The [ISO/IEC 10373-6] Calibration Coil 1 2.2.3 Approval of the Test Bench The complete Test Bench shall be approved by EMVCo before the Testing Laboratory is allowed to provide official type approval testing services to PICC vendors. of 209 2.2.4 Test Bench Organization The Test Bench shall be governed by standard operating procedures. These procedures shall include:
• Calibration
• Operator training
• Test bench operation
• Test bench maintenance 2.2.4.1 Calibration Each item of measurement equipment shall be calibrated according to its calibration guidelines once a year. In any case, calibration shall be performed and documented in compliance with ISO/IEC 17025:2017 - General Requirements for the Competence of Calibration and Testing Laboratories.

2.2.4.2 Operator Training The Testing Laboratory shall ensure operator training to establish the required level of skills and expertise prior to any testing operations. To ensure the quality of testing, it is recommended that additional training be provided to personnel at least once per year and that close attention be paid to customer requirements.

2.2.4.3 Test Bench Operation The Testing Laboratory shall prepare and maintain documentation covering all relevant aspects of the design, implementation and operation of its proprietary Test Bench and its interaction with EMV – TEST Equipment that are necessary for correct operation. The Testing Laboratory shall operate the Test Bench in accordance with this documentation.

2.2.4.4 Test Bench Maintenance Each piece of measuring equipment shall undergo regular preventive maintenance, as required by its operating specifications. Written records of such maintenance operations shall be kept by the Testing Laboratory. In case of Test Bench failure, corrective maintenance shall take place to repair the Test Bench. The repaired Test Bench instruments and accessories shall be restored to their original Testing Laboratory approved standard performance levels. Written records of maintenance operations shall also be kept by the Testing Laboratory.

2.2.5 Recognition by EMVCo Only Testing Laboratories that are recognised by EMVCo are authorized to perform EMV Analogue Interface Testing.

2.2.6 Compliance to ISO 17025 The Testing Laboratory shall prove to EMVCo that they operate their Test Bench in compliance with ISO/IEC 17025:2017 General Requirements for the Competence of Calibration and Testing Laboratories.

of 209 2.3 Controlled Test Conditions Analogue Interface Testing shall be carried out under controlled test conditions. Refer to ISO/IEC 17025, section 5.3 for details.

2.3.1 Power Supply Conditions At the beginning of a test session, the Testing Laboratory shall ensure that all electrical power supplies are within the range required for their purpose. Power supply voltage shall be measured with calibrated measurement equipment while the power supply is connected to the load.

2.3.2 Temperature and Humidity The normal temperature and humidity conditions for analogue tests should be any convenient combination of temperature and humidity within the following ranges:

• Temperature: 23°C ± 3°C
• Relative humidity: 40% to 60% RH When it is impossible to perform tests under these conditions, a note to this effect, stating the ambient temperature and relative humidity during the tests, shall be added to the test report.

2.3.3 RF Environment 2.3.3.1 Interference Issues EMI appears in many different forms. The most prominent in Testing Laboratories are the intentional radiators, such as PCDs and other communication devices in the 1 to 100 MHz range of the RF spectrum. In addition, cordless telephones and mobile telephones can be significant interferers in Testing Laboratories. Another form of interference is EMI radiated from incidental sources: devices and/or systems that are not designed to transmit intentionally. Such interference is also known as broadband emission or noise, and may be generated by any electronic or electrical device and/or system. This interference may lead to incorrect measurements. Extraneous noise may radiate from many sources. These are so numerous that it is virtually impossible for all of these suspected devices to be completely managed or controlled. However, efforts must be made to restrict the level of interference signals coming from these sources. The laboratory shall have ISO/IEC 17025 compliant procedures in place to monitor and control the RF environment to ensure that it does not adversely affect the quality of the measurements covered in this document.

2.3.3.2 Managing the RF Environment The RF spectrum (from 1 to 100 MHz) should be managed by documenting all frequencies as follows:

• Using a spectrum analyzer for initial benchmarking of the level, nature, and impact of conducted and radiated RF signals that may affect the reliability of measurements.
• Recording critical frequencies of other Testing Laboratory devices and/or systems.
• Preventing the intrusion of interfering sources into vulnerable test frequencies (always scan for noise as well as intentional transmitters). of 209
• Managing this information and knowing which frequencies are in use in the environment.
• Scanning the Testing Laboratory environment regularly for possible broadband emissions, especially in areas where PICCs are in use or under test. RF cables connected to Test Bench equipment shall be as short as possible, ideally less than 50 cm. However, cables connected to computers and power supplies may have a length of up to 100 cm. This allows physical separation of the equipment to minimize coupling of electromagnetic disturbances to sensitive components of the Test Bench. The laboratory shall check the condition of the RF cables to minimize cable and connection losses as a regular maintenance item. Note: Equipment such as computers and power supplies should be selected to be as quiet as possible in terms of electro-magnetic disturbances towards the Test Bench. of 209 3 Positioning Conventions and Requirements 3.1 Importance of Positioning The correct positioning of PICCs during testing is of critical importance with EMV Contactless technology due to the fact that:
• PICCs come in many forms, such as a card, a key fob, a mobile, a wearable, a token, etc.
• The cardholder can either tap the PICC onto the PCD or simply wave it in front of the PCD. It is very important to understand the positioning characteristics applied to PICCs and PCDs and the relationship of these positioning characteristics to the Operating Volume. This ensures successful and repeatable testing of the various PICCs and PCDs available on the market.

3.2 Conventions Regarding Positioning For best accuracy and consistency in testing PICCs, the position of the device must be precisely set.

3.2.1 Positioning Characteristics for the EMV – TEST PCD The designated surface area of an EMV – TEST PCD against which a PICC is positioned during testing is referred to as the Landing Plane. The Landing plane is the surface of the Perspex stand. The Landing Plane of the EMV – TEST PCD is the plane located 15 mm above its antenna and parallel to this antenna.

Figure 3-1 shows the EMV – TEST PCD positioning characteristics.

of 209 Figure 3-1—EMV – TEST PCD Positioning Characteristics Note: The conventions used in this chapter relate to Appendix B of the EMV Level 1 Specifications for Payment Systems ― EMV Contactless Interface Specification. The Z axis of the EMV – TEST PCD is the axis which passes through the centre of the Landing Plane. The Z axis is orthogonal to the Landing Plane and points outwards from the EMV – TEST PCD Landing Plane top surface. The φ=0 axis is an axis defined on the Landing Plane to support the indication of the orientation of the EMV – TEST PICC versus the EMV – TEST PCD. In theory, the φ=0 axis is the writing direction of the PCD.

3.2.2 Positioning Characteristics for the EMV – TEST PICC When the EMV – TEST PICC is presented over the Landing Plane of the EMV – TEST PCD, the plane on the EMV – TEST PICC that faces the EMV – TEST PCD is called the Presentation Plane.

Figure 3-2 shows the EMV – TEST PICC positioning characteristics.

of 209 Figure 3-2—EMV – TEST PICC Positioning Characteristics The Presentation Plane is on the bottom of the EMV – TEST PICC (dotted lines). The ZC axis of the EMV – TEST PICC is an axis which passes through the centre of the Presentation Plane. This axis is also orthogonal to the Presentation Plane and points outwards from the bottom surface of the EMV – TEST PICC Presentation Plane. The point on the Presentation Plane where the ZC axis begins is called the centre of the Presentation Plane. The φC=0 axis is the axis defined on the Presentation Plane to identify the orientation of the EMV – TEST PICC versus the EMV – TEST PCD.

3.2.3 Positioning Characteristics for the PICC Under Test

Note: For testing, the PICC under test shall have markings indicating the centre of the Presentation Plane and the direction of the φC=0 axis. These marks should be placed by the Laboratory before starting the Type Approval test session.

of 209 For ID-1 PICC testing, the centre of the Presentation Plane is the physical centre of the product. The Presentation Plane can be identified according to the first applicable rule amongst the following: If… A contact plate is present on the card. Then… The contact plate of the embedded chip is on the side opposite to the Presentation Plane, close to the left side. A magnetic stripe is present on the card. The magnetic stripe is on the side of the Presentation Plane towards the position (z, r, 3) of EMV – TEST PCD operating volume. A PAN (embossed or laser-engraved) is present on the card The PAN is on the side opposite to the Presentation Plane and readable from position (z, r, 6) to position (z, r, 0). Any text is present on the card. The text on the card is on the side opposite to the Presentation Plane and readable from position (z, r, 6) to position (z, r, 0). A contactless chip is identifiable on the card. The contactless chip is on the position (z, r, 6) side close to the position (z, r, 3) of EMV – TEST PCD operating volume. A contactless chip is not identifiable on the card. Contact the vendor to identify the front and upper sides of the card. The front side of the card shall be the side opposite to the Presentation Plane. The upper side of the card shall be towards position (z, r, 3) of EMV – TEST PCD operating volume.

3.2.4 Relative Positioning of the PICC Under Test and EMV – TEST PCD The Presentation Plane of the PICC Under Test shall remain parallel to the EMV–TEST PCD Landing Plane during all the testing session.

of 209 Figure 3-3 shows the relative positioning of a PICC Under Test and EMV – TEST PCD when both are perfectly aligned and parallel. Figure 3-3—Relative Positioning of Perfectly Aligned and Parallel PICC Under Test and EMV – TEST PCD The position of the PICC Under Test relative to the EMV – TEST PCD is defined with four coordinates (z, r, φ and θ) as shown in Table 3-1: Coordinate z r φ θ Description Coordinate starting at the centre of the Presentation Plane: a point along the Z axis. Coordinate starting at the centre of the Presentation Plane: a point along the radius defined from the centre of the Presentation Plane (for example 25 mm). Coordinate starting at the centre of the Presentation Plane: this coordinate is explained in section 3.2.4.1. Angle defining the orientation of the EMV – TEST PICC with respect to the EMV – TEST PCD. This coordinate is explained in section 3.2.4.2. Unit mm mm Radians Radians Table 3-1—Positioning Coordinate Definitions

3.2.4.1 Definition of φ Angle Coordinate Figure 3-4 shows four possible positions of a PICC Under Test: