EMV® Terminal Level 1 Type Approval – PCD Analogue Test Bench and Test Case Requirements

EMV® Contactless Terminal Level 1 Type Approval PCD Analogue Test Bench and Test Case Requirements Version 3.2a.r September 2025

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Legal Notice

This document summarizes EMVCo’s present plans for evaluation services and related policies and is subject to change by EMVCo at any time. This document does not create any binding obligations upon EMVCo or any third party regarding the subject matter of this document, which obligations will exist, if at all, only to the extent set forth in separate written agreements executed by EMVCo or such third parties. In the absence of such a written agreement, no product provider, test laboratory or any other third party should rely on this document, and EMVCo shall not be liable for any such reliance. No product provider, test laboratory or other third party may refer to a product, service or facility as EMVCo approved, in form or in substance, nor otherwise state or imply that EMVCo (or any agent of EMVCo) has in whole or part approved a product provider, test laboratory or other third party or its products, services, or facilities, except to the extent and subject to the terms, conditions and restrictions expressly set forth in a written agreement with EMVCo, or in an approval letter, compliance certificate or similar document issued by EMVCo. All other references to EMVCo approval are strictly prohibited by EMVCo. Under no circumstances should EMVCo approvals, when granted, be construed to imply any endorsement or warranty regarding the security, functionality, quality, or performance of any particular product or service, and no party shall state or imply anything to the contrary. EMVCo specifically disclaims any and all representations and warranties with respect to products that have received evaluations or approvals, and to the evaluation process generally, including, without limitation, any implied warranties of merchantability, fitness for purpose or noninfringement. All warranties, rights and remedies relating to products and services that have undergone evaluation by EMVCo are provided solely by the parties selling or otherwise providing such products or services, and not by EMVCo, and EMVCo will have no liability whatsoever in connection with such products and services. This document is provided "AS IS" without warranties of any kind, and EMVCo neither assumes nor accepts any liability for any errors or omissions contained in this document. EMVCO DISCLAIMS ALL REPRESENTATIONS AND WARRANTIES, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE AND NONINFRINGEMENT, AS TO THIS DOCUMENT. EMVCo makes no representations or warranties with respect to intellectual property rights of any third parties in or in relation to this document. EMVCo undertakes no responsibility to determine whether any implementation of this document may violate, infringe, or otherwise exercise the patent, copyright, trademark, trade secret, know-how, or other intellectual property rights of third parties, and thus any person who implements any part of this document should consult an intellectual property attorney before any such implementation. Without limiting the foregoing, this document may provide for the use of public key encryption and other technology, which may be the subject matter of patents in several countries. Any party seeking to implement this document is solely responsible for determining whether its activities require a license to any such technology, including for patents on public key encryption technology. EMVCo shall not be liable under any theory for any party's infringement of any intellectual property rights in connection with this document.

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Revision Log – 3.2a.r The following changes have been made to the document since the publication of Version 3.2a. Some of the numbering and cross references in this version have been updated to reflect changes introduced by the published bulletins. The numbering of existing requirements did not change, unless explicitly stated otherwise. Incorporated changes described in the following Specification Updates: None Other editorial changes: Editorial Updates

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Contents 1. 1.1. 1.2. 1.3. 1.3.1. 1.3.2. 1.3.3. 1.4. 1.5. 1.5.1. 1.6. 1.7. 2. 2.1. 2.2. 2.2.1. 2.2.2. 2.2.3. 2.2.4. 2.2.5. 2.2.6. 2.3. 2.3.1. 2.3.2. 2.3.3. 3. 3.1. 3.2. 3.2.1. 3.2.2. 3.2.3. 3.3. 3.4. 3.4.1. 3.4.2. 3.5. 4. 4.1. 4.1.1. 4.1.2. 4.1.3.

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4.1.4. 4.2. 4.2.1. 4.2.2. 4.2.3. 4.2.4. 4.3. 4.3.1. 4.3.2. 4.3.3. 4.3.4. 5. 5.1. 5.1.1. 5.1.2. 5.2. 5.2.1. 5.2.2. 5.2.3. 5.2.4. 5.2.5. 5.2.6. 5.2.7. 5.3. 5.3.1. 5.3.2. 5.4. 5.4.1. 5.4.2. 6. 6.1. 6.2. 6.2.1. 6.2.2. 6.3. 6.4. 6.4.1. 6.4.2. 6.4.3. 6.4.4. 6.5. 6.6.

v3.2a.r Page v 6.6.1. 6.6.2. 6.6.3. 6.7. 6.8. 7. 7.1. 7.2. 7.2.1. 7.3. 7.3.1. 7.4. 7.4.1. 7.4.2. 7.5. 7.5.1. 8. 8.1. 8.2. 8.2.1. 8.2.2. 8.3. 8.3.1. 8.3.2. 8.4. 8.5. 8.6. 8.7. 8.8. 8.8.1. 8.8.2. 8.8.3. 8.8.4. 8.8.5. 8.8.6. 8.8.7. 8.8.8. 8.8.9. A. A.1. B.

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B.1. C. C.1. C.2. C.3. C.4. C.4.1. C.4.2. D. D.1. D.1.1. D.1.2. E. E.1. E.2. E.3. E.4.

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Figure 4-1—EMV – TEST PICC 1, Version 3. Figure 4-2—EMV – TEST PICC 1, Version 3. Figure 4-3—EMV – TEST PCD, Version 2.1 Figure 4-4—EMV – TEST CMR Circuit Board, Version 2.1 v3.2a.r

Figure E-1— Actual overshoot occurring after a rising edge (TA128). v3.2a.r

Table 8-6—EMV – TEST PICCs for Test TAB111.x.1. Table 8-7—Test Positions of Test TAB111.x.1. Table 8-8—Test Positions of Test TAB113.0.0. Table 8-9—Test Positions of Test TAB115.0.0. Table 8-10—Test Positions of Test TAB116.0.0. Table 8-11— EMV – TEST PICCs for Test TA121.x.y. Table 8-12— EMV – TEST PICC Loads for Test TA121.x.y.

v3.2a.r Page x Table 8-13—Test Positions of Test TA121.x.y. Table 8-14— EMV – TEST PICCs for Test TA122.x.y. Table 8-15—EMV – TEST PICC Loads for Test TA122.x.y. Table 8-16—Test Positions of Test TA122.x.y. Table 8-17—EMV – TEST PICCs for Test TA123.x.y. Table 8-18—EMV – TEST PICC Loads for Test TA123.x.y. Table 8-19—Test Positions of Test TA123.x.y. Table 8-20—EMV – TEST PICCs for Test TA124.x.y. Table 8-21—EMV – TEST PICC Loads for Test TA124.x.y. Table 8-22—Test Positions of Test TA124.x.y. Table 8-23—EMV – TEST PICCs for Test TA125.x.y. Table 8-24—EMV – TEST PICC Loads for Test TA125.x.y. Table 8-25—Test Positions of Test TA125.x.y. Table 8-26—EMV – TEST PICCs for Test TA127.x.y. Table 8-27—EMV – TEST PICC Loads for Test TA127.x.y. Table 8-28—Test Positions of Test TA127.x.y. Table 8-29—EMV – TEST PICCs for Test TA128.x.y. Table 8-30—EMV – TEST PICC Loads for Test TA128.x.y. Table 8-31—Test Positions of Test TA128.x.y. Table 8-32—EMV – TEST PICCs for Test TA129.x.y. Table 8-33—EMV – TEST PICC Loads for Test TA129.x.y. Table 8-34—Test Positions of Test TA129.x.y. Table 8-35—EMV – TEST PICCs for Test TA131.x.1. Table 8-36—Test Positions of Test TA131.x.1. Table 8-37—EMV – TEST PICCs for Test TA132.x.1. Table 8-38—Test Positions of Test TA132.x.1. Table 8-39—EMV – TEST PICCs for Test TA133.x.1. Table 8-40—Test Positions of Test TA133.x.1. Table 8-41—EMV – TEST PICCs for Test TA134.x.1. Table 8-42—Test Positions of Test TA134.x.1. Table 8-43—EMV – TEST PICCs for Test TA135.x.1. Table 8-44—Test Positions of Test TA135.x.1. Table 8-45—EMV – TEST PICCs for Test TA136.x.1. Table 8-46—Test Positions of Test TA136.x.1. Table 8-47—EMV – TEST PICCs for Test TA137.x.1. Table 8-48—Test Positions of Test TA137.x.1. Table 8-49—EMV – TEST PICCs for Test TA138.x.1. Table 8-50—Test Positions of Test TA138.x.1. Table 8-52—EMV – TEST PICCs for Test TB121.x.y. Table 8-53—EMV – TEST PICC Loads for Test TB121.x.y. Table 8-54—Test Positions of Test TB121.x.y. Table 8-55—EMV – TEST PICCs for Test TB122.x.y. Table 8-56—EMV – TEST PICC Loads for Test TB122.x.y. Table 8-57—Test Positions of Test TB122.x.y. Table 8-58—EMV – TEST PICCs for Test TB123.x.y. Table 8-59—EMV – TEST PICC Loads for Test TB123.x.y. Table 8-60—Test Positions of Test TB123.x.y. Table 8-61—EMV – TEST PICCs for Test TB124.x.y. Table 8-62—EMV – TEST PICC Loads for Test TB124.x.y. Table 8-63—Test Positions of Test TB124.x.y. Table 8-64—EMV – TEST PICCs for Test TB125.x.y. Table 8-65—EMV – TEST PICC Loads for Test TB125.x.y. Table 8-66—Test Positions of Test TB125.x.y.

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Table 8-67—EMV – TEST PICCs for Test TB126.x.y. Table 8-68—EMV – TEST PICC Loads for Test TB126.x.y. Table 8-69—Test Positions of Test TB126.x.y. Table 8-70—EMV – TEST PICC s for Test TB127.x.y. Table 8-71—EMV – TEST PICC Loads for Test TB127.x.y. Table 8-72—Test Positions of Test TB127.x.y. Table 8-73—EMV – TEST PICCs for Test TB131.x.1. Table 8-74—Test Positions of Test TB131.x.1. Table 8-75—EMV – TEST PICCs for Test TB132.x.1. Table 8-76—Test Positions of Test TB132.x.1. Table 8-77—EMV – TEST PICCs for Test TB133.x.1. Table 8-78—Test Positions of Test TB133.x.1. Table 8-79—EMV – TEST PICCs for Test TB134.x.1. Table 8-80—Test Positions of Test TB134.x.1. Table 8-81—EMV – TEST PICCs for Test TB135.x.1. Table 8-82─Test Positions of Test TB135.x.1. Table 8-83—EMV – TEST PICCs for Test TB136.x.1. Table 8-84—Test Positions of Test TB136.x.1. Table 8-85—EMV – TEST PICCs for Test TB137.x.1. Table 8-86—Test Positions of Test TB137.x.1. Table 8-87—EMV – TEST PICCs for Test TB138.x.1. Table 8-88—Test Positions of Test TB138.x.1. Table A. Table A. Table A. Table A. Table A. Table B. Table C. Table C. Table C. Table C.

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/ 240 1. Using this Manual 1.1.

Purpose

The EMVCo Contactless Type Approval: PCD Analogue Test Bench and Test Case Requirements manual provides the requirements for procedures and test equipment used for testing the analogue interface PCDs. These requirements are in accordance with the EMV Level 1 Specifications for Payment Systems ― EMV Contactless Interface Specification Version 3.2, July 2022. 1.2. Audience This manual is provided to:

• PCD Vendors
• Testing laboratories recognised to perform the Type Approval tests 1.3. Reference Documents EMV documents are available on the EMVCo web site: https://www.emvco.com 1.3.1. Standards Documents Document ISO/IEC 17025:2017: General Requirements for the Competence of Testing and Calibration Laboratories ISO/IEC Guide 98-3:2008: Uncertainty of measurement ─ Part 3 ─ Guide to the expression of uncertainty in measurement, ISO/IEC, corrected version 2010. Version Issue Date 2017-11 2008 1.3.2. Specification Documents EMV Level 1 Specifications for Payment Systems ― EMV Contactless Interface Specifications Version 3.2, July 2022 v3.2a.r EMV Contactless Symbol Reproduction Requirements / 240 Version 2.0, 30 October 2019 EMV Specification Bulletin No. 282 – PPS0 and PPS1 RFU Value Handling EMV Specification Bulletin No. 283 – PCD Carrier Phase Drift EMV Specification Bulletin No. 300 – PICC Presence Check Procedure EMV Specification Bulletin No. 303 Adding an Optional Suspend and a Mandatory Suspend in the Polling Loop EMV Contactless Specifications for Payment Systems – Level 1 – Test Equipment Specifications – PICC Manual EMV Contactless Specifications for Payment Systems – Level 1 – Test Equipment Specifications – PCD Manual EMV Contactless Specifications for Payment Systems – Level 1 – Test Equipment Specifications – CMR Manual EMVCo Type Approval Laboratory Recognition Requirements. IEEE Standard on transitions, Pulses and related Waveforms, IEEE Std 181-2011. First Edition, March 2023 First Edition, March 2023 First Edition, June 2024 Second Edition, May 2024 Version 3.0.1, November 2020 Version 2.1, February 2012 Version 2.1, February 2012 1.3.3. Laboratory Test Documents The test documents to be applied by EMVCo recognised laboratories when performing an EMV Contactless Terminal Type Approval Level 1 session are listed in the following document: EMVCo Type Approval Contactless Terminal Level 1 Laboratories Documentation Check the last version of this document for any update of the test documents. 1.4.

Definitions

In addition of terms already defined in the reference documentation, the following terms are used in this document: Term Definition Analogue Test Set of tests that check the Radio Frequency characteristics of the hardware and software/firmware of the PCD against the EMV Specifications.

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/ 240 Term Device Test Environment EMV – TEST CMR EMV – TEST PCD EMV – TEST PICC [ISO/IEC 10373-6] Calibration Coil 1 Envelope Landing Plane LOOPBACK Application LOOPBACK mode Modulation Index Operating Volume PCD Type Approval PCD Under Test PCD Vendor Polling Presentation Plane Proximity Coupling Device (PCD) Proximity Integrated Circuit Card (PICC) Definition Part of the Test Environment needed to perform the PCD Type Approval Test, which the Vendor needs to develop and submit to the Testing Laboratory at the same time as the Samples. A hardware device qualified as reference equipment which is used with other EMV – TEST Equipment. Its purpose is to condition and switch signals between its inputs and outputs. A hardware device qualified as reference equipment which is used with other EMV – TEST Equipment. Its purpose is to simulate a PCD. A PICC simulator used for EMV testing Hardware device used to measure Reset and Power Off functions. Waveform connecting positive or negative peaks of oscillating signal. The designated surface area of a PCD where a user should place a PICC to obtain a successful transaction. Test application that the vendor needs to develop and implement in the Device Test Environment. LOOPBACK involves cycling back information in a channel. Any data transmitted through such a channel is immediately received by the same channel. A device is in loopback mode after such a mode has been activated. The modulation index of an amplitude modulated signal is defined as mi = ([A(t)]MAX - ([A(t)]MIN)/([A(t)]MAX + [A(t)]MIN) where A(t) is the envelope of the modulated carrier. The 3-dimensional space in which the PCD shall reliably communicate with a PICC by means of a magnetic field. Acknowledgment by EMVCo that a specified PCD within a specified Contactless Product has demonstrated sufficient conformance to the EMV Specification. PCD embedded in the Sample that is actually tested during Type Approval Test. Entity that submits the PCD for PCD Type Approval. Sequence during which the PCD sends alternatively WUPA and WUPB commands until a response is received. The plane on the EMV – TEST PICC that faces the EMV – TEST PCD. A hardware device that uses inductive coupling to provide power to the PICC and exchange data with the PICC. A hardware device containing an integrated circuit and capable of inductive coupling in the proximity of a coupling device.

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/ 240 Term Sample Set-up Terminal Test Bench Test Case Test Code Test Environment Testing Laboratory Test Report Transaction Definition A physical implementation of a PICC or a PCD delivered to the Testing Laboratory for testing. Procedure to follow to prepare EMV – TEST Equipment before starting a test. Any device used to interact with a PICC and which operates to the requirements of the EMV Level 1 Specifications for Payment Systems ― EMV Contactless Interface Specification. This includes the PCD and may also include other components and interfaces. A specific test bench as described in the EMVCo Contactless Type Approval: PCD Analogue Test Bench and Test Case Requirements manual. Test to verify a requirement at a specific position in the Operating Volume. Code to identify a Test Case. Environment needed to perform the Test. It is constituted of a Test Bench in combination with a Device Test Environment for PCD Type Approval Test. A facility recognised by EMVCo for performing EMV Contactless testing of the analogue interface for PICCs and PCDs. Document provided by the Testing Laboratory containing the Test results. A sequence of logic interactions that the PICC and the Terminal shall execute as foreseen by the EMV Contactless application. The transaction starts with the first logic message from the PCD to the PICC. 1.5. Notational Conventions The following abbreviations and notations are used in this document: Abbreviation Description z, r, φ, θ These four coordinates define the position of the PICC in the Operating Volume. The coordinates z, r, and φ are the coordinates of the centre of the Presentation Plane. The coordinate θ is the angle between the φ=0 axis of the PCD, and the φ=0 axis of the PICC. (zrf) Position label indicating the values for coordinates z, r, φ. xx Value.

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/ 240 1.5.1. Acronyms and Abbreviations Abbreviation A/D AC CLn ASK ATQA ATQB ATTRIB BPSK CH0 CH1 CLK CMR DIV DSO DTE EMC EMI EoF EoS EOT etu fC fS HLTA HLTB I2C IC ICS ID-1 IEC IEEE MSa/s PAN PCD Analogue to Digital Descritpion Anticollision Cascade Level n, Type A Amplitude Shift Keying

Answer

To reQuest, Type A Answer To reQuest, Type B PICC Selection Command, Type B Binary Phase Shift Keying Channel 0 Channel 1 Clock Common Mode Rejection Division Digital Sampling Oscilloscope Device Test Environment Electromagnetic Compatibility Electromagnetic Interference End of Frame End of Sequence End of Test Elementary time unit Carrier Frequency Subcarrier Frequency Halt Command, Type A Halt Command, Type B Inter Integrated Circuit Integrated Circuit Implementation Conformance Statement Identification Card Format International Electrotechnical Commission Institute of Electrical and Electronic Engineers Mega Samples / Second Primary Account Number Proximity Coupling Device

v3.2a.r Abbreviation PICC PUT RATS RF RH rms SELECT CLn SMA SoF SoS Trg TTA TTL UID Vpp VSWR WUPA WUPB Proximity IC Card Descritpion PCD Under Test Request for Answer to Select, Type A Radio Frequency Relative Humidity Root mean square Select Cascade Level n, Type A Subminiature version A Start of Frame Start of Sequence Trigger Terminal Type Approval Transistor-Transistor Logic Unique Identifier, Type A Peak to Peak Amplitude Voltage Voltage Standing Wave Ratio Wake UP command, Type A Wake UP command, Type B

/ 240 1.6. Terminology and Conventions The following words are used often in this specification and have a specific meaning: Shall Defines a product or system capability which is mandatory. May Defines a product or system capability which is optional or a statement which is informative only and is out of scope for this specification. Should Defines a product or system capability which is recommended. 1.7. Support For support regarding EMV Contactless analogue testing, refer to www.emvco.com.

v3.2a.r 2. Requirements for Testing Laboratories

/ 240 2.1. Overview and Requirements The EMVCo Contactless Type Approval: PCD Analogue Test Bench and Test Case Requirements manual provides the Test Cases for testing of the analogue interface of terminals. Analogue interface testing is one of the phases related to EMVCo Terminal Type Approval (TTA). 2.2. Recognition Requirements This section describes the requirements for passing full recognition. Replacing the test equipment by any other devices voids recognition for testing of the analogue interface for EMV Contactless products. 2.2.1. Using EMV – TEST Equipment The EMV – TEST Equipment comprises the following: 2.2.1.1. EMV – TEST Proximity Integrated Circuit Card The EMV – TEST Proximity Integrated Circuit Card (PICC) emulates the radio frequency (RF) interface of EMV Contactless PICCs. There are three EMV – TEST PICCs with different form factors and resonant frequencies. 2.2.1.2. EMV – TEST Proximity Coupling Device The EMV – TEST Proximity Coupling Device (PCD) emulates the RF interface of an EMV Contactless terminal. 2.2.1.3. EMV – TEST Common Mode Rejection Circuit Board The EMV – TEST Common Mode Rejection (CMR) circuit board aims at conditioning signals and switching them between its inputs and outputs for Test Bench set-ups. 2.2.2. Creation of the Test Bench The Testing Laboratory shall use an EMVCo qualified Test Tool for its test bench creation. The Test Tool shall include:

• The EMV – TEST PICC 1
• The EMV – TEST PICC 2
• The EMV – TEST PICC 3
• The EMV – TEST PCD v2.1
• The EMV – TEST CMR
• The [ISO/IEC 10373-6] Calibration Coil 1
• IQ – TEST PICC. v3.2a.r / 240 Note: For this version of the PCD Type Approval, Analogue testing are conducted using EMV – TEST PCD v2.1 even if the Specification refers to EMV – TEST PCD v3.0. The setup values to be used are consequently different from the ones defined in the specification, and are defined in Table B.1. The term EMV – TEST PCD refers to EMV – TEST PCD v2.1 throughout the document. 2.2.3. Approval of the Test Bench The complete test bench shall be approved by EMVCo before the Testing Laboratory is allowed to provide official type approval testing services to PCD vendors. 2.2.4. Test Bench Organization The Test Bench shall be governed by standard operating procedures. These procedures shall include:
• Calibration
• Operator training
• Test bench operation
• Test bench maintenance 2.2.4.1. Calibration Each item of measurement equipment shall be calibrated according to its calibration guidelines once a year. In any case, calibration shall be performed and documented in compliance with ISO /IEC 17025:2017 - General Requirements for the Competence of Calibration and Testing Laboratories. 2.2.4.2. Operator Training The Testing Laboratory shall ensure operator training to establish the required level of skills and expertise prior to any testing operations. To ensure the quality of testing, it is recommended that additional training be provided to personnel at least once per year and that close attention be paid to customer requirements. 2.2.4.3. Test Bench Operation The Testing Laboratory shall prepare and maintain documentation covering all relevant aspects of the design, implementation and operation of its proprietary Test Bench and its interaction with EMV – TEST Equipment that are necessary for correct operation. The Testing Laboratory shall operate the Test Bench in accordance with this documentation. 2.2.4.4. Test Bench Maintenance Each piece of measuring equipment shall undergo regular preventive maintenance, as required by its operating specifications. Written records of such maintenance operations shall be kept by the Testing Laboratory. In case of test bench failure, corrective maintenance shall take place to repair the test bench. The repaired test bench instruments and accessories shall be restored to their original Testing v3.2a.r / 240 Laboratory approved standard performance levels. Written records of maintenance operations shall also be kept by the Testing Laboratory. 2.2.5. Recognition by EMVCo Only Testing Laboratories that are recognised by EMVCo are authorized to perform EMV analogue interface testing. 2.2.6. Official Compliance to ISO 17025 The Testing Laboratory shall prove to EMVCo that they operate their test bench in compliance with ISO/IEC 17025:2017 - General Requirements for the Competence of Calibration and Testing Laboratories. Also refer to the EMVCo Type Approval Laboratory Recognition Requirements document for additional recognition requirements. 2.3. Controlled Test Conditions Analogue Interface testing shall be carried out under controlled test conditions. Refer to ISO/IEC 17025, section 5.3 and 5.4 for details. 2.3.1. Power Supply Conditions At the beginning of a test session, the Testing Laboratory shall ensure that all electrical power supplies are within the range required for their purpose. Power Supply voltage shall be measured with calibrated measurement equipment while the Power Supply is connected to the load. 2.3.2. Temperature and Humidity The normal temperature and humidity conditions for analogue tests should be any convenient combination of temperature and humidity within the following ranges:
• Temperature: 23°C ± 3°C
• Relative humidity: 40 % to 60 % When it is impossible to perform tests under these conditions, a note to this effect, stating the ambient temperature and relative humidity during the tests, shall be added to the test report. 2.3.3. RF Environment 2.3.3.1. Interference Issues Electromagnetic Interference (EMI) appears in many different forms. The most prominent in Testing Laboratories are the intentional radiators, such as other PCDs under test and other communication devices in the 1 to 100 MHz range of the RF spectrum. In addition, cordless telephones and mobile telephones can be significant interferers in Testing Laboratories. Another form of interference is EMI radiated from incidental sources: devices and/or systems that are not designed to transmit intentionally. Such interference is also known as broadband emission or “noise,” and may be generated by any electronic or electrical device and/or system. This interference may lead to incorrect measurements. v3.2a.r / 240 Extraneous noise may radiate from many sources. These are so numerous that it is virtually impossible for all of these suspected devices to be completely managed or controlled. However, efforts must be made to restrict the level of interference signals coming from these sources. The laboratory shall have ISO/IEC 17025 compliant procedures in place to monitor and control the RF environment to ensure that it does not adversely affect the quality of the measurements covered in this document. 2.3.3.2. Managing the RF Environment The RF spectrum (from 1 to 100 MHz) should be managed by documenting all frequencies as follows:
• Using a spectrum analyzer for initial benchmarking of the level, nature, and impact of conducted and radiated RF signals that may affect the reliability of measurements.
• Recording critical frequencies of other Testing Laboratory devices and/or systems.
• Preventing the intrusion of interfering sources into vulnerable test frequencies (always scan for noise as well as intentional transmitters).
• Managing this information and knowing which frequencies are in use in the environment.
• Scanning the Testing Laboratory environment regularly for possible broadband emissions, especially in areas where PCDs are in use or under test. RF cables connected to Test Bench equipment shall be as short as possible, ideally less than 50 cm. However, cables connected to computers and power supplies may have a length of up to 100 cm. This allows physical separation of the equipment to minimize coupling of electromagnetic disturbances to sensitive components of the Test Bench. The laboratory shall check the condition of the RF cables to minimize cable and connection losses as a regular maintenance item. Note: Equipment such as computers and power supplies should be selected to be as quiet as possible in terms of electro-magnetic disturbances towards the Test Bench. v3.2a.r / 240 3. Positioning Conventions and Requirements 3.1. Importance of Positioning The correct positioning of PICCs and PCDs during testing is of critical importance with EMV Contactless technology, due to the fact that:
• PCDs come in many forms, such as a standard terminal in a retail location, a card reader in front of a public transport turnstile, a wireless hand-held device, etc.
• The cardholder can either tap the PICC onto the PCD or simply wave it in front of the PCD. It is very important to understand the positioning characteristics applied to PICCs and PCDs and the relationship of these positioning characteristics to the Operating Volume. This ensures successful and repeatable testing of the various PICCs and PCDs available on the market. 3.2. Conventions Regarding Positioning For best accuracy and consistency in testing PCDs, the position of the device must be precisely set. 3.2.1. Positioning Characteristics for the EMV – TEST PCD The designated surface area of an EMV – TEST PCD against which a PICC is positioned during testing is referred to as the Landing Plane. The Landing plane is the surface of the Perspex stand. The Landing Plane of the EMV – TEST PCD is the plane located 15 mm above its antenna and parallel to this antenna. v3.2a.r Figure 3-1 shows the EMV – TEST PCD positioning characteristics: / 240 Figure 3-1—EMV – TEST PCD Positioning Characteristics Note: The conventions used in this chapter relate to Appendix B of the EMV Level 1 Specifications for Payment Systems ― EMV Contactless Interface Specification. The Z axis of the EMV – TEST PCD is the axis which passes through the centre of the Landing Plane. The Z axis is orthogonal to the Landing Plane and points outwards from the EMV – TEST PCD Landing Plane top surface. The φ=0 axis is an axis defined on the Landing Plane to support the indication of the orientation of the EMV – TEST PICC versus the EMV – TEST PCD. In theory, the φ=0 axis is the writing direction of the EMV – TEST PCD. v3.2a.r / 240 3.2.2. Positioning Characteristics for the EMV – TEST PICC When the EMV – TEST PICC is presented over the Landing Plane of a PCD, the plane on the EMV – TEST PICC that faces the PCD is called the Presentation Plane. Figure 3-2 shows the EMV – TEST PICC positioning characteristics: Figure 3-2—EMV – TEST PICC Positioning Characteristics The Presentation Plane is on the bottom surface of the PICC (dotted lines). The Zc axis of the EMV – TEST PICC is an axis which passes through the centre of the Presentation Plane. This axis is also orthogonal to the Presentation Plane and points outwards from the EMV – TEST PICC Presentation Plane’s bottom surface. The point on the Presentation Plane where the Zc axis begins is called the centre of the Presentation Plane. The φc=0 axis is the axis defined on the Presentation Plane to identify the orientation of the EMV – TEST PICC versus the EMV – TEST PCD. 3.2.3. Relative Positioning of the EMV – TEST PICC and PCD Under Test The Presentation Plane of the EMV – TEST PICC shall remain parallel to the Landing Plane of the PCD Under Test during all the testing session. Figure 3-3 shows the relative positioning v3.2a.r / 240 of an EMV – TEST PICC and PCD when both Presentation Plane and Landing Plane are perfectly aligned and parallel: Figure 3-3—Relative Positioning of Perfectly Aligned and Parallel EMV – TEST PICC and PCD The position of the EMV – TEST PICC relative to the PCD is defined with four coordinates (z, r, φ and θ), as shown in Table 3-1: Coordinate z r φ θ

Description

Coordinate starting at the centr